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Technical Features of W-Ti Sputtering Targets by UVTM
In the manufacturing of electronic components and flat panel displays, maintaining consistent thin-film deposition quality is a persistent industry requirement. As a specialized material manufacturer, UV Tech Material LTD. (UVTM) focuses on the development and production of Tungsten Titanium (W-Ti) sputtering targets, offering material solutions for standard industrial production lines.
For the fabrication of barrier and adhesion layers, processing refractory metals like tungsten and titanium presents specific engineering challenges. To address these material characteristics, UVTM utilizes a thermal spray forming process combined with high-temperature densification. This specific manufacturing route primarily helps increase the density of the target blank, lower internal porosity, and improve the structural uniformity of the refractory metals. During standard magnetron sputtering operations, a higher density supports relatively stable discharge characteristics.
The W/Ti mass ratio of this target series can be adjusted according to specific customer process requirements. According to our standard product specifications, the nominal purity of these W-Ti targets is controlled at ≥99.9%. Based on this purity baseline, the specification is primarily suitable for applications such as conventional flat panel displays, photovoltaics, decorative coatings, and certain packaging metallization processes. If intended for front-end semiconductor applications, critical impurity elements (such as oxygen, carbon, nitrogen, and alkali metals) must be further evaluated and verified against process windows. Available in both planar and rotary configurations, UVTM offers W-Ti sputtering targets for standard industrial production lines.
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